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LTC6255CDC#TRMPBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTC6255CDC#TRMPBF - OP AMP, 6.5MHZ, 1.8V/US, DFN-6

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LTC6255CDC#TRMPBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DC(DFN)_1
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LTC6255CDC#TRMPBF - Analog Devices  - 3D model - Small Outline No-lead - DC(DFN)_1
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LTC6255CDC#TRMPBF Details

  • Manufacturer Part Number:

    LTC6255CDC#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DFN-7

  • Pin Count:

    6

  • Manufacturer Package Code:

    05-08-1703

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.075 µA

  • Bias Current-Max (IIB) @25C:

    0.075 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    700 µV

  • JESD-30 Code:

    S-PBCC-N7

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    SOLCC6,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    1.8 V/us

  • Supply Current-Max:

    0.166 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    6500

  • Voltage Gain-Min:

    8000

  • Wideband:

    NO

  • Width:

    2 mm

LTC6255CDC#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6255 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the bypass capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the datasheet provides a recommended PCB layout and land pattern that should be followed.
  • To ensure stability, it's essential to follow the recommended compensation network and component values provided in the datasheet. Additionally, the input and output capacitors should be chosen carefully to ensure they meet the recommended values and types. The datasheet also provides guidance on how to calculate the compensation components for specific applications.
  • The maximum power dissipation of the LTC6255 is dependent on the package type and the ambient temperature. For the CDC#TRMPBF package, the maximum power dissipation is approximately 1.4W at 25°C ambient temperature. However, this value can be derated based on the ambient temperature and the thermal resistance of the package.
  • The LTC6255 is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to follow the recommended operating conditions and derate the power dissipation accordingly to ensure reliable operation in high-temperature environments.
  • The LTC6255 has built-in overvoltage protection (OVP) and electrostatic discharge (ESD) protection. However, it's still recommended to add external protection devices such as TVS diodes or zener diodes to protect the device from voltage transients and ESD events. Additionally, following proper PCB design and layout practices can help reduce the risk of ESD damage.

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LTC6255CDC#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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