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LTC6259HDC#TRMPBF - Analog Devices

Description: IC OPAMP GP 2 CIRCUIT 8DFN

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LTC6259HDC#TRMPBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DC8 Package 8-Lead Plastic DFN (2mm × 2mm)
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LTC6259HDC#TRMPBF - Analog Devices  - 3D model - Small Outline No-lead - DC8 Package 8-Lead Plastic DFN (2mm × 2mm)
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LTC6259HDC#TRMPBF Details

  • Manufacturer Part Number:

    LTC6259HDC#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1719

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.075 µA

  • Common-mode Reject Ratio-Min:

    64 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.075 µA

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,18

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Min:

    0.2 V/us

  • Slew Rate-Nom:

    0.24 V/us

  • Supply Current-Max:

    0.05 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.45 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1300

  • Voltage Gain-Min:

    3500

  • Wideband:

    NO

  • Width:

    2 mm

LTC6259HDC#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6259HDC involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability in high-gain configurations, it's essential to follow the recommended compensation network and component values, and to ensure that the device is operated within its specified bandwidth. Additionally, using a low-ESR output capacitor and minimizing parasitic capacitance can help maintain stability.
  • The maximum power dissipation of the LTC6259HDC is dependent on the package type and thermal resistance. The maximum power dissipation can be calculated using the formula: Pd = (Vcc x Icc) + (Vout x Iout). It's essential to ensure that the device is operated within its specified thermal limits to prevent overheating.
  • Yes, the LTC6259HDC can be used as a unity-gain buffer. However, it's essential to ensure that the input and output impedances are matched, and that the device is operated within its specified bandwidth. Additionally, the output capacitor value and ESR can affect the stability of the device in unity-gain configurations.
  • To troubleshoot oscillations or instability issues in the LTC6259HDC, check the PCB layout for parasitic capacitance and inductance, ensure that the input and output capacitors are properly selected, and verify that the device is operated within its specified bandwidth. Additionally, check for voltage supply noise and ensure that the device is properly decoupled.

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LTC6259HDC#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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