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LTC6405IMS8E#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTC6405IMS8E#PBF - Differential Amplifier, Low Noise, 1 Amplifiers, 6 mV, 1 dB, 2.7 GHz, -40 °C, 85 °C

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LTC6405IMS8E#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
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LTC6405IMS8E#PBF - Analog Devices  - 3D model - Small Outline Packages - MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
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LTC6405IMS8E#PBF Details

  • Manufacturer Part Number:

    LTC6405IMS8E#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1662

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC6405IMS8E#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC6405 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, adding a small resistor (e.g., 10Ω) in series with the output can help dampen oscillations.
  • The maximum power dissipation of the LTC6405 is dependent on the package type and thermal environment. For the IMS8E package, the maximum power dissipation is approximately 1.4W at 25°C ambient temperature. However, this can be increased with proper heat sinking and thermal management.
  • While the LTC6405 is primarily a high-speed amplifier, it can be used as a voltage regulator in certain applications. However, it's essential to ensure that the output voltage is within the device's specified range (0.5V to 5.5V) and that the input voltage is within the recommended range (2.7V to 5.5V). Additionally, the output current should not exceed the maximum specified current (150mA).
  • To protect the LTC6405 from overvoltage and ESD, it's recommended to add external protection devices such as TVS diodes or zener diodes on the input and output pins. Additionally, following proper PCB design and layout guidelines can help reduce the risk of ESD damage.

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LTC6405IMS8E#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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