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LTC7066RMSE#PBF - Analog Devices

Description: Gate Drivers 150V dual symmetric Gate Driver

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LTC7066RMSE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 12-Lead Plastic MSOPcc
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LTC7066RMSE#PBF - Analog Devices  - 3D model - Small Outline Packages - 12-Lead Plastic MSOPcc
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LTC7066RMSE#PBF Details

  • Manufacturer Part Number:

    LTC7066RMSE#PBF

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    EXPOSED PAD MINI_SOIC

  • Package Description:

    MSOP-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    EXPOSED PAD MINI_SOIC

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G12

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    6 A

  • Output Polarity:

    TRUE AND INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP12,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    14 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    10 V

  • Supply Voltage1-Max:

    14 V

  • Supply Voltage1-Min:

    4 V

  • Supply Voltage1-Nom:

    10 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.02 µs

  • Turn-on Time:

    0.02 µs

  • Width:

    3 mm

LTC7066RMSE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC7066 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor has a low ESR and is properly sized for the output voltage and current. A minimum output capacitance of 10uF is recommended.
  • The maximum input voltage that the LTC7066 can handle is 15V. Exceeding this voltage can cause damage to the device. It's recommended to add input voltage protection, such as a voltage clamp or a TVS diode, to prevent overvoltage conditions.
  • The LTC7066 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the output current and voltage at high temperatures to ensure reliable operation.
  • To troubleshoot issues with the LTC7066, start by checking the input voltage, output voltage, and output current. Verify that the component values and PCB layout meet the recommended specifications. Use an oscilloscope to check for oscillations or noise on the output. Consult the datasheet and application notes for troubleshooting guidelines.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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