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LTC8143ESW#PBF - Analog Devices

Description: IC DAC 12BIT A-OUT 16SOIC

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LTC8143ESW#PBF - Analog Devices - PCB symbol
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LTC8143ESW#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S Package 16-Lead Plastic SOL
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LTC8143ESW#PBF - Analog Devices - 3D model - Small Outline Packages - S Package 16-Lead Plastic SOL
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LTC8143ESW#PBF Details

  • Manufacturer Part Number:

    LTC8143ESW#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.300 INCH, PLASTIC, SO-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1620 (SW16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY, OFFSET BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Linearity Error-Max (EL):

    0.0122%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Settling Time-Nom (tstl):

    0.25 µs

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

LTC8143ESW#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC8143ESW involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a separate analog ground plane and to keep the analog and digital grounds separate.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. It's also important to decouple the device properly and to use a low-impedance output capacitor.
  • The maximum input voltage that the LTC8143ESW can handle is 36V, but it's recommended to operate the device within the specified input voltage range of 2.5V to 36V for optimal performance and reliability.
  • The LTC8143ESW is rated for operation from -40°C to 125°C, but it's recommended to derate the device's performance and reliability at high temperatures. It's also important to ensure that the device is properly heatsinked and that the PCB is designed to handle high temperatures.
  • To troubleshoot issues with the LTC8143ESW, start by checking the input and output voltages, and ensure that the device is properly powered and configured. Check the PCB layout and component values to ensure they match the recommended values. Use an oscilloscope to check for oscillations or other anomalies, and consult the datasheet and application notes for guidance.

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LTC8143ESW#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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