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LTF5022T-1R8N3R1-D - TDK

Description: SMD / SMT Inductors (Coils), L=1.8?H, L x W x T :

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PCB Footprints
LTF5022T-1R8N3R1-D - TDK PCB footprint - Inductors Chip - Inductors Chip - MLG1005S1-1
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3D Models
LTF5022T-1R8N3R1-D - TDK  - 3D model - Inductors Chip - MLG1005S1-1
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LTF5022T-1R8N3R1-D Details

  • Manufacturer Part Number:

    LTF5022T-1R8N3R1-D

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    2020

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.037 Ω

  • Inductance-Nom (L):

    1.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.2 mm

  • Package Length:

    5 mm

  • Package Style:

    SMT

  • Package Width:

    5 mm

  • Packing Method:

    TR, 7 INCH

  • Rated Current-Max:

    3.12 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    30%

LTF5022T-1R8N3R1-D Frequently Asked Questions (FAQs)

  • The recommended land pattern for LTF5022T-1R8N3R1-D can be found in the TDK Corporation's application note or footprint library. It is essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal and electrical issues.
  • While LTF5022T-1R8N3R1-D is a robust component, it is still susceptible to vibration. TDK Corporation recommends following the guidelines for vibration testing and ensuring that the component is properly secured to the PCB to minimize the risk of damage or failure.
  • Proper thermal management is crucial for the reliability and performance of LTF5022T-1R8N3R1-D. Ensure that the component is mounted on a thermally conductive material, and consider using thermal vias or heat sinks to dissipate heat. Follow the thermal design guidelines provided by TDK Corporation for optimal performance.
  • LTF5022T-1R8N3R1-D is designed to operate within a specific temperature and humidity range. Exceeding these limits can affect its performance and reliability. Ensure that the component is operated within the recommended environmental conditions to prevent damage or failure.
  • The recommended soldering profile for LTF5022T-1R8N3R1-D can be found in the TDK Corporation's application note or soldering guide. It is essential to follow the recommended soldering profile to prevent damage to the component and ensure reliable connections.

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LTF5022T-1R8N3R1-D Overview

Use the download button to access the LTF5022T-1R8N3R1-D schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LTF50, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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