LTH-306-04M footprint, schematic symbol and 3D model by Lite-On

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LTH-306-04M Details

A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer of the PCB, connected to the thermal pad of the LTH-306-04M. This will help to dissipate heat efficiently.
To ensure reliable soldering, it is recommended to use a soldering iron with a temperature of 250°C to 270°C, and to apply a small amount of solder paste to the thermal pad. The component should be placed on a flat, even surface to prevent solder bridging.
The maximum allowable voltage that can be applied to the LTH-306-04M is 40V, as specified in the datasheet. Exceeding this voltage may result in damage to the device.
To protect the LTH-306-04M from ESD, it is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure that all personnel handling the device are grounded.
The typical junction-to-case thermal resistance of the LTH-306-04M is 2.5°C/W, as specified in the datasheet.

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