Bivar recommends a PCB layout with a solid ground plane and thermal vias under the device to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the PCB.
To ensure reliable operation in high-vibration environments, Bivar recommends using a secure mounting method, such as screwing or adhesive, and ensuring the device is properly seated on the PCB. Additionally, consider using a vibration-dampening material, such as a silicone adhesive, between the device and the PCB.
The maximum allowable temperature for storage and handling of the LTM1805GD is 40°C (104°F) to prevent damage to the device.
While the LTM1805GD is designed to operate in a variety of environments, it's not recommended for use in extremely humid environments (>80% RH). If operation in a humid environment is necessary, consider using a conformal coating or potting the device to protect it from moisture.
Bivar recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. A soldering iron with a temperature range of 200-250°C (392-482°F) is also acceptable.
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LTM1805GD Overview
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