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LTM2886HY-5I#PBF - Analog Devices

Description: I²C Digital Isolator 2500Vrms 6 Channel 400kHz 30kV/µs CMTI 32-BBGA Module

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LTM2886HY-5I#PBF - Analog Devices PCB footprint - BGA - BGA - CHIP SCALE BGA_2023
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LTM2886HY-5I#PBF - Analog Devices - 3D model - BGA - CHIP SCALE BGA_2023
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LTM2886HY-5I#PBF Details

  • Manufacturer Part Number:

    LTM2886HY-5I#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1851

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-XBGA-B32

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA32,8X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.62 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.25 mm

LTM2886HY-5I#PBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance of the LTM2886HY-5I involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the power supply. Additionally, it is recommended to use a 4-layer PCB with a dedicated layer for the analog signals.
  • To ensure the reliability of the LTM2886HY-5I in high-temperature applications, it is recommended to follow proper thermal management practices, such as using a heat sink, ensuring good airflow, and keeping the device within its specified operating temperature range. Additionally, it is recommended to follow the recommended soldering and assembly procedures to prevent thermal stress on the device.
  • The maximum cable length that can be used with the LTM2886HY-5I depends on the specific application and the type of cable used. However, as a general rule, it is recommended to keep the cable length as short as possible to minimize signal attenuation and noise. A maximum cable length of 1-2 meters is typically recommended.
  • Yes, the LTM2886HY-5I is designed to provide isolation between the analog and digital circuits, making it suitable for applications that require isolation. The device uses a proprietary isolation technology to provide a high level of isolation between the analog and digital circuits, making it suitable for use in applications such as industrial control systems, medical devices, and automotive systems.
  • The typical power consumption of the LTM2886HY-5I depends on the specific application and the operating conditions. However, according to the datasheet, the typical power consumption of the device is around 1.5W. This makes it suitable for use in battery-powered devices and other applications where power consumption is a concern.

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LTM2886HY-5I#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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