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LTM2886HY-5S#PBF - Analog Devices

Description: 6-Channel Logic Isolator: 2500VRMS for 1 Minute n UL-CSA Recognized File #E151738 n Isolated DC Power: n 3V to 5V Adjustable at Up to 100mA n ±5V Fixed at Up to 100mA n No External Components Required n SPI/Digital (LTM2886-S) or I2C (LTM2886-I) Options n High Common Mode Transient Immunity: 30kV/μs n High Speed Operation: n 10MHz Digital Isolation n 4MHz/8MHz SPI Isolation n 400kHz I2C Isolation Low Profile (15mm × 11.25mm × 3.42mm) BGA Package

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LTM2886HY-5S#PBF - Analog Devices - PCB symbol
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LTM2886HY-5S#PBF - Analog Devices PCB footprint - BGA - BGA - BGA Package 32-Lead (15mm × 11.25mm × 3.42mm)
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LTM2886HY-5S#PBF - Analog Devices - 3D model - BGA - BGA Package 32-Lead (15mm × 11.25mm × 3.42mm)
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LTM2886HY-5S#PBF Details

  • Manufacturer Part Number:

    LTM2886HY-5S#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1851

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-XBGA-B32

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA32,8X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.62 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.25 mm

LTM2886HY-5S#PBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the LTM2886HY-5S can be found in the application note AN136-1, which provides guidelines for layout, component placement, and thermal management to ensure optimal performance and reliability.
  • The output voltage of the LTM2886HY-5S can be set using the VOUT pin. The recommended output voltage range is 2.5V to 5.5V. To select the correct output voltage, refer to the datasheet and application notes for guidance on calculating the required output voltage and setting the VOUT pin accordingly.
  • The maximum input voltage that the LTM2886HY-5S can handle is 36V. Exceeding this voltage may damage the device. It's essential to ensure that the input voltage is within the recommended range to ensure reliable operation.
  • The LTM2886HY-5S has a built-in overcurrent protection feature that can be enabled by connecting a resistor between the OCP pin and GND. The value of the resistor determines the overcurrent threshold. Refer to the datasheet and application notes for guidance on implementing overcurrent protection.
  • The thermal derating curve for the LTM2886HY-5S can be found in the datasheet. The curve provides information on the maximum power dissipation of the device as a function of ambient temperature. This information is essential for ensuring reliable operation and preventing overheating.

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LTM2886HY-5S#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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