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LTM2887CY-3I#PBF - Analog Devices

Description: SPI/Digital or I2C ??Module Isolator with Dual Adjustable 5V Regulators

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LTM2887CY-3I#PBF - Analog Devices PCB footprint - BGA - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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LTM2887CY-3I#PBF - Analog Devices  - 3D model - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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LTM2887CY-3I#PBF Details

  • Manufacturer Part Number:

    LTM2887CY-3I#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1851

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-XBGA-B32

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA32,8X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.62 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.25 mm

LTM2887CY-3I#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTM2887CY-3I involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, the input and output traces should be kept short and away from noise sources. Refer to the application note AN136 for more detailed layout guidelines.
  • The LTM2887CY-3I requires a power-up sequence to ensure proper initialization. The VCC pin should be powered up first, followed by the VIO pin. The EN pin should be pulled high to enable the device. Additionally, the device requires a clock signal on the CLK pin to operate. Refer to the datasheet for the recommended power-up sequence and timing diagrams.
  • The maximum cable length supported by the LTM2887CY-3I depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 10 meters for RS-485 and 100 meters for RS-232. It's recommended to use a shielded cable and follow proper termination and grounding techniques to ensure reliable data transmission.
  • To troubleshoot communication issues with the LTM2887CY-3I, start by checking the power supply and clock signal to ensure they are within the recommended specifications. Verify that the device is properly configured and initialized. Use a logic analyzer or oscilloscope to check the signal integrity and timing on the TX and RX pins. Also, check for any noise or interference on the signal lines and ensure proper termination and grounding.
  • Yes, the LTM2887CY-3I is designed to support hot-swap and hot-plug applications. The device has built-in protection against voltage and current surges during hot-swap events. However, it's recommended to follow proper design guidelines and use additional protection components such as TVS diodes and resistors to ensure reliable operation.

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LTM2887CY-3I#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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