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LTM2887HY-3I#PBF - Analog Devices

Description: Digital Isolators I2C uModule Isolator Adjustable +/-5V Regulated Power

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LTM2887HY-3I#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTM2887HY-3I#PBF - Analog Devices PCB footprint - BGA - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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3D Models
LTM2887HY-3I#PBF - Analog Devices - 3D model - BGA - 32-Lead (15mm x 11.25mm x 3.42mm)
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LTM2887HY-3I#PBF Details

  • Manufacturer Part Number:

    LTM2887HY-3I#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    05-08-1851

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-XBGA-B32

  • Length:

    11.25 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA32,8X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.62 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

LTM2887HY-3I#PBF Frequently Asked Questions (FAQs)

  • Analog Devices provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using shielded cables for sensitive signals.
  • The LTM2887HY-3I#PBF has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB. Additionally, ensure good airflow around the device, and consider using a heat sink or thermal interface material if the device will be operating at high temperatures or high power levels.
  • The datasheet provides some guidance on input and output filtering, but it's generally recommended to use a pi-filter (series inductor and shunt capacitor) on the input and output lines to reduce noise and EMI. The specific filter components will depend on the application and operating frequency.
  • Analog Devices provides a troubleshooting guide in the datasheet, which includes steps such as checking the power supply, input and output connections, and PCB layout. Additionally, using a scope or spectrum analyzer to measure the device's output and input signals can help identify issues such as oscillations or noise.
  • The LTM2887HY-3I#PBF is a QFN package, which requires a reflow soldering process. Follow the recommended soldering profile in the datasheet, and ensure the PCB is clean and free of oxidation. Hand soldering is not recommended due to the small size of the package.

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LTM2887HY-3I#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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