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LTM4636IY#PBF - Analog Devices

Description: 40A DC/DC μModule Regulator

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LTM4636IY#PBF - Analog Devices PCB footprint - BGA - BGA - 144-Lead (16mm × 16mm × 7.07mm
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LTM4636IY#PBF - Analog Devices  - 3D model - BGA - 144-Lead (16mm × 16mm × 7.07mm
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LTM4636IY#PBF Details

  • Manufacturer Part Number:

    LTM4636IY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-144

  • Pin Count:

    144

  • Manufacturer Package Code:

    05-08-1937

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    OPERATES IN ADJUSTABLE MODE FROM 0.6V TO 3.3V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    15 V

  • Input Voltage-Min:

    4.7 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PXMA-B144

  • JESD-609 Code:

    e1

  • Length:

    16 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    40 A

  • Output Voltage-Max:

    3.3 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XMA

  • Package Shape:

    SQUARE

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    7.42 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1200 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    UNSPECIFIED

  • Width:

    16 mm

LTM4636IY#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device's exposed pad should be connected to a thermal pad on the PCB, and the PCB should have a thermal relief pattern to facilitate heat dissipation.
  • Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Also, ensure the device is properly heatsinked and the PCB is designed for optimal thermal performance.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially catastrophic failure. It is essential to ensure the device operates within its specified temperature range.
  • Start by verifying the input voltage, output voltage, and output current are within the specified ranges. Check for proper PCB layout, thermal design, and component selection. Use oscilloscopes and other diagnostic tools to identify issues such as oscillations, noise, or instability.
  • Use proper PCB layout techniques, such as separating analog and digital grounds, using shielding, and minimizing loop areas. Ensure the device is properly decoupled, and use EMI filters or common-mode chokes as needed to minimize electromagnetic interference.

Trust Checks

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LTM4636IY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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