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LTM4643EV#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTM4643EV#PBF - DC/DC POL Converter, Adjustable, Buck, 1.2 MHz, 600 mV to 3.3 V out, 3 A, LGA-77

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LTM4643EV#PBF - Analog Devices PCB footprint - BGA - BGA - 77-Lead (15.00mm × 9.00mm ×1.82mm)
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LTM4643EV#PBF - Analog Devices  - 3D model - BGA - 77-Lead (15.00mm × 9.00mm ×1.82mm)
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LTM4643EV#PBF Details

  • Manufacturer Part Number:

    LTM4643EV#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LGA-77

  • Pin Count:

    77

  • Manufacturer Package Code:

    05-08-1508

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 0.6 TO 3.3V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    4 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PBGA-N77

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    77

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    3.3 V

  • Output Voltage-Min:

    0.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    1.92 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1200 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    OTHER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    9 mm

LTM4643EV#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the switching components close to the IC and use a thermal relief pattern under the IC to improve heat dissipation.
  • Use a combination of ceramic and electrolytic capacitors to minimize ESL and ESR. Choose inductors with low DCR and high saturation current. Optimize the filter component values using simulation tools or online calculators.
  • Choose input capacitors with low ESR, high ripple current rating, and a voltage rating that exceeds the maximum input voltage. X5R or X7R ceramic capacitors are recommended. Ensure the capacitors are placed close to the IC and connected to the input pins with short, wide traces.
  • Use a soft-start circuit to limit the inrush current during start-up. Add a delay between the enable signal and the input voltage to ensure the IC is fully enabled before the input voltage is applied. Use a voltage supervisor or a power-good signal to monitor the output voltage and ensure a clean shutdown.
  • The IC has a thermal pad that must be connected to a solid ground plane or a thermal relief pattern. Ensure good airflow around the IC and use a heat sink if necessary. Monitor the junction temperature and adjust the thermal design accordingly.

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LTM4643EV#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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