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LTM4658IY#PBF - Analog Devices

Description: Low VIN, High Efficiency 10A Step-Down DC/DC μModule Regulator

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LTM4658IY#PBF - Analog Devices PCB footprint - BGA - BGA - (BC-25-2)-1
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LTM4658IY#PBF - Analog Devices  - 3D model - BGA - (BC-25-2)-1
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LTM4658IY#PBF Details

  • Manufacturer Part Number:

    LTM4658IY#PBF

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CHIP SCALE BGA

  • Package Description:

    BGA-25

  • Pin Count:

    25

  • Manufacturer Package Code:

    CHIP SCALE BGA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2022-01-13

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE SKIP MODE

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.25 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-PBGA-B25

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    10 A

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    0.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA25,5X5,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Seated Height-Max:

    4.78 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2600 kHz

  • Technology:

    HYBRID

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    4 mm

LTM4658IY#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device on a thick copper plane, using thermal vias to dissipate heat, and keeping the thermal path short and direct. A 4-layer PCB with a solid ground plane and a thermal plane is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and conformal coatings to improve thermal performance.
  • Operating the device at a lower input voltage than the recommended minimum may result in reduced performance, increased power consumption, and potential reliability issues. It's essential to ensure that the input voltage meets the recommended minimum to guarantee optimal performance and reliability.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback network. Ensure that the input voltage is within the recommended range, the output load is within the specified current limit, and the feedback network is properly configured. Also, verify that the device is properly soldered and that there are no signs of physical damage or contamination.
  • To minimize EMI and RFI, follow proper PCB layout and design guidelines, use shielding and filtering components, and ensure that the device is operated within its specified frequency range. Additionally, consider using EMI-absorbing materials and conformal coatings to reduce radiated emissions.

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LTM4658IY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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