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LTM4663IV#PBF - Analog Devices

Description: Ultrathin 1.5A ?Module Thermoelectric Cooler (TEC) Regulator

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LTM4663IV#PBF - Analog Devices PCB footprint - BGA - BGA - 25-Lead (4mm × 3.5mm × 1.3mm)
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LTM4663IV#PBF - Analog Devices  - 3D model - BGA - 25-Lead (4mm × 3.5mm × 1.3mm)
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LTM4663IV#PBF Details

  • Manufacturer Part Number:

    LTM4663IV#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LGA-25

  • Pin Count:

    25

  • Manufacturer Package Code:

    05-08-1785

  • ECCN Code:

    EAR99

  • HTS Code:

    8473.30.11.80

  • Date Of Intro:

    2020-04-13

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PBGA-B25

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFLGA

  • Package Equivalence Code:

    LGA25,5X5,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.4 mm

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    2000 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    BUTT

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    3.5 mm

LTM4663IV#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pads away from high-frequency signals and ensure good thermal conduction to the heat sink.
  • Use a combination of ceramic and electrolytic capacitors to minimize ESL and ESR. Optimize the inductor value and type for the specific application. Consider using a common-mode choke for noise reduction.
  • Not using the EN pin can lead to increased power consumption and heat generation during shutdown. It's recommended to use the EN pin to ensure proper shutdown and minimize power consumption.
  • Use a soft-start circuit to limit the inrush current during start-up. Ensure the input voltage is stable and within the recommended range during shutdown. Use a voltage supervisor or reset IC to ensure proper reset and start-up sequencing.
  • Use a heat sink with a thermal interface material (TIM) to ensure good thermal conduction. Ensure good airflow around the device and heat sink. Consider using a fan or heat pipe for high-power applications.

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LTM4663IV#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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