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LTM4693EV#PBF - Analog Devices

Description: Ultrathin Low VIN, 2A Buck-Boost μModule Regulator

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LTM4693EV#PBF - Analog Devices PCB footprint - Other - Other - LGA Package 25-LEAD (3.5mm × 4mm × 1.25mm)
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LTM4693EV#PBF - Analog Devices  - 3D model - Other - LGA Package 25-LEAD (3.5mm × 4mm × 1.25mm)
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LTM4693EV#PBF Details

  • Manufacturer Part Number:

    LTM4693EV#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LGA-25

  • Pin Count:

    25

  • Manufacturer Package Code:

    05-08-7014

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    AVERAGE CURRENT

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.6 V

  • Input Voltage-Nom:

    3.8 V

  • JESD-30 Code:

    R-XXMA-N25

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    1.8 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    1.35 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    4000 kHz

  • Technology:

    HYBRID

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    UNSPECIFIED

  • Width:

    3.5 mm

LTM4693EV#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the LTM4693EV#PBF near a thermal pad or heat sink, using thick copper traces for power and ground, and minimizing the number of vias under the device. Additionally, a solid ground plane and a separate power plane can help to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using thermal interface materials and conformal coatings to improve thermal performance and protect the device from moisture and contaminants.
  • The recommended input and output capacitors for the LTM4693EV#PBF depend on the specific application and operating conditions. However, as a general guideline, use low-ESR capacitors with a minimum capacitance of 10uF for the input and 22uF for the output. X5R or X7R ceramic capacitors are suitable options.
  • To troubleshoot overvoltage or undervoltage faults, start by checking the input voltage and ensuring it's within the recommended range. Verify that the output voltage is within the specified range and that the device is not overheating. Check for any signs of physical damage, such as burnt components or broken pins. Use an oscilloscope to monitor the input and output voltages and look for any anomalies.
  • The recommended soldering profile for the LTM4693EV#PBF involves a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The temperature should rise at a rate of 3°C/second and fall at a rate of 6°C/second. It's essential to follow the recommended soldering profile to prevent damage to the device.

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LTM4693EV#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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