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LTM8022EV#PBF - Analog Devices

Description: 1A 36V DC/DC Module LTM8022EV

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LTM8022EV#PBF - Analog Devices PCB footprint - Other - Other - LGA Package 50-Lead (11.25mm×9.00mm × 2.82mm)
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LTM8022EV#PBF - Analog Devices  - 3D model - Other - LGA Package 50-Lead (11.25mm×9.00mm × 2.82mm)
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LTM8022EV#PBF Details

  • Manufacturer Part Number:

    LTM8022EV#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    11.25 X 9 MM, 2.82 MM HEIGHT, ROHS COMPLIANT, MO-222, LGA-50

  • Pin Count:

    50

  • Manufacturer Package Code:

    05-08-1804

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 0.8V TO 10V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    3.6 V

  • Input Voltage-Nom:

    10 V

  • JESD-30 Code:

    R-PBGA-N50

  • JESD-609 Code:

    e4

  • Length:

    11.25 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    50

  • Operating Temperature-Max:

    85 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    10 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LGA

  • Package Equivalence Code:

    LGA50,7X8,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.92 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2400 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

LTM8022EV#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
  • Use a combination of X-capacitors, Y-capacitors, and common-mode chokes to filter out electromagnetic interference (EMI). Ensure that the filter components are placed close to the device and connected to a solid ground plane.
  • Use a low-noise, high-PSRR LDO regulator, and ensure that the input and output capacitors are of high quality and placed close to the device. Also, minimize the loop area and use a solid ground plane to reduce noise coupling.
  • Ensure good thermal contact between the device and the heat sink, and use a thermal interface material (TIM) to fill any gaps. Also, consider the airflow and convection around the heat sink to optimize heat dissipation.

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LTM8022EV#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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