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LTM8024EY#PBF - Analog Devices

Description: Switching Voltage Regulators 40Vin Dual 3.5 Step Down uModule Regulat

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LTM8024EY#PBF - Analog Devices PCB footprint - BGA - BGA - bga88
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LTM8024EY#PBF - Analog Devices  - 3D model - BGA - bga88
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LTM8024EY#PBF Details

  • Manufacturer Part Number:

    LTM8024EY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-88

  • Pin Count:

    88

  • Manufacturer Package Code:

    05-08-1535

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-08-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PBGA-B88

  • JESD-609 Code:

    e1

  • Length:

    11.25 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    88

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3.5 A

  • Output Voltage-Max:

    8 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA88,8X11,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    3.52 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3000 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

LTM8024EY#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
  • Use a combination of X-capacitors, Y-capacitors, and common-mode chokes to filter out electromagnetic interference (EMI) and ensure compliance with regulatory standards.
  • Use a low-noise, high-PSRR LDO regulator, and ensure a clean and stable input voltage. Add bypass capacitors and noise filters as needed to minimize noise and ripple.
  • Ensure good thermal contact between the device and heat sink, and use thermal interface materials (TIMs) to minimize thermal resistance. Consider the device's power dissipation and thermal impedance when designing the heat sink.

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LTM8024EY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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