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LTM8040EV#PBF - Analog Devices

Description: 1A 2.5 ~ 13V Constant Current LED Driver Buck Topology 1 Output , 13W , 66-LGA , 0°C ~ 125°C

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LTM8040EV#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTM8040EV#PBF - Analog Devices PCB footprint - Other - Other - LGA Package 66-Lead (15mm × 9mm × 4.32mm)_2025
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LTM8040EV#PBF - Analog Devices - 3D model - Other - LGA Package 66-Lead (15mm × 9mm × 4.32mm)_2025
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LTM8040EV#PBF Details

  • Manufacturer Part Number:

    LTM8040EV#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    15 X 9 MM, 4.32 MM HEIGHT, ROHS COMPLIANT, MO-222, LGA-66

  • Pin Count:

    66

  • Manufacturer Package Code:

    05-08-1810

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PBGA-N66

  • JESD-609 Code:

    e4

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    2

  • Number of Terminals:

    66

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LGA

  • Package Equivalence Code:

    LGA66,7X11,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.32 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

LTM8040EV#PBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane, using thermal vias to connect the exposed pad to the ground plane, and keeping the thermal path as short as possible.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, use a heat sink if necessary, and consider derating the device's output current and voltage according to the temperature derating curves provided in the datasheet.
  • Using a lower input voltage than the recommended minimum may result in reduced output voltage regulation, increased output voltage ripple, and decreased efficiency. It is recommended to use an input voltage within the specified range to ensure optimal performance.
  • To troubleshoot output voltage regulation issues, check the input voltage, output load, and feedback resistors for correct values and connections. Verify that the device is properly configured and that the output voltage is within the specified range. Use an oscilloscope to measure the output voltage ripple and noise, and consult the datasheet for troubleshooting guidelines.
  • The LTM8040EV#PBF is designed to meet EMI and EMC standards, but proper PCB layout, component selection, and shielding are still necessary to ensure compliance. Follow the recommended layout guidelines, use EMI filters and shielding if necessary, and consult the datasheet for EMI and EMC-related information.

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LTM8040EV#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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