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LTM8049IY#PBF - Analog Devices

Description: Dual SEPIC or Inverting µModule DC/DC Converter, BGA-77

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LTM8049IY#PBF - Analog Devices PCB footprint - BGA - BGA - BGA Package 77-Lead (15.00mm × 9.00mm × 2.42mm)-ren1
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LTM8049IY#PBF - Analog Devices  - 3D model - BGA - BGA Package 77-Lead (15.00mm × 9.00mm × 2.42mm)-ren1
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LTM8049IY#PBF Details

  • Manufacturer Part Number:

    LTM8049IY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-77

  • Pin Count:

    77

  • Manufacturer Package Code:

    05-08-1964

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    ADJUSTBLE OUTPUT MODE FROM 2.5 V AND 24 V AND ADJUSTBLE OUTPUT MODE FROM -2.5 V AND -24 V

  • Analog IC - Other Type:

    DUAL SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    2.6 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PBGA-B77

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    77

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    24 V

  • Output Voltage-Min:

    2.5 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.62 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    PHASE-SHIFT

  • Switching Frequency-Max:

    2900 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

LTM8049IY#PBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
  • Use a combination of X-capacitors, Y-capacitors, and common-mode chokes to filter out electromagnetic interference (EMI) and reduce noise. Ensure proper PCB layout and component placement to minimize noise coupling.
  • Optimize the switching frequency, adjust the output voltage, and select the right inductor and capacitor values to minimize power losses and maximize efficiency.
  • Ensure good airflow, use a heat sink or thermal pad, and consider thermal interface materials to reduce thermal resistance. Monitor the device's junction temperature to prevent overheating.

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LTM8049IY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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