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LTM8056IY#PBF - Analog Devices

Description: Switching Voltage Regulators 58VIN, 48Vout Buck-Boost Module Reg

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LTM8056IY#PBF - Analog Devices - PCB symbol
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LTM8056IY#PBF - Analog Devices PCB footprint - BGA - BGA - 2019-04-24
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3D Models
LTM8056IY#PBF - Analog Devices - 3D model - BGA - 2019-04-24
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LTM8056IY#PBF Details

  • Manufacturer Part Number:

    LTM8056IY#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    121

  • Manufacturer Package Code:

    05-08-1891

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    OUTPUT VOLTAGE RANGE FROM 1.2 VOLT TO 48 VOLT

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    58 V

  • Input Voltage-Min:

    5 V

  • Input Voltage-Nom:

    6 V

  • JESD-30 Code:

    S-PBGA-B121

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    121

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    5.12 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    800 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

LTM8056IY#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device's thermal pad should be connected to a large copper area on the PCB to dissipate heat efficiently.
  • Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Also, ensure the device is properly heatsinked and the PCB is designed for optimal thermal performance.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the input capacitor. The capacitor should be placed close to the device's input pins to minimize noise and ensure stable operation.
  • Use a low-noise input voltage source, add a noise filter to the input voltage, and ensure the device is properly decoupled with ceramic capacitors. Also, minimize the PCB's noise coupling by using a solid ground plane and separating the analog and digital grounds.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the output capacitor. The capacitor should be placed close to the device's output pins to minimize noise and ensure stable operation.

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LTM8056IY#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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