LTR10EZPJ471 footprint, schematic symbol and 3D model by ROHM Semiconductor

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LTR10EZPJ471 Details

ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliability, follow the recommended derating curves for temperature and power dissipation. Also, consider using a heat sink or thermal interface material to reduce the junction temperature.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less to prevent thermal shock.
Yes, the LTR10EZPJ471 is designed to withstand vibrations up to 10G. However, it's recommended to follow proper PCB mounting and screwing techniques to ensure the device remains securely attached.
Store the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads.

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