ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
ROHM recommends following the derating curve in the datasheet, and ensuring that the device is operated within the specified temperature range. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
ROHM recommends a soldering profile with a peak temperature of 260°C, and a dwell time of 10-30 seconds. The component should be soldered using a Pb-free solder alloy, and the soldering process should be done in a nitrogen atmosphere.
ROHM recommends storing the component in a dry, cool place, away from direct sunlight and moisture. The component should be handled with anti-static precautions, and should not be exposed to mechanical stress or vibration during shipping.
The expected lifespan of the LTR18EZPFSR075 depends on various factors such as operating conditions, temperature, and usage patterns. However, ROHM estimates a typical lifespan of 10-15 years in a typical application, with a failure rate of less than 1% per 1000 hours.
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LTR18EZPFSR075 Overview
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