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LTR18EZPJ152 - ROHM Semiconductor

Description: 1632(0612)Size, High Power Chip Resistor <Wide Terminal Type> (AEC-Q200 Qualified)

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LTR18EZPJ152 - ROHM Semiconductor - PCB symbol
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PCB Footprints
LTR18EZPJ152 - ROHM Semiconductor PCB footprint - Resistor Chip - Resistor Chip - LTR18
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LTR18EZPJ152 - ROHM Semiconductor - 3D model - Resistor Chip - LTR18
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LTR18EZPJ152 Details

  • Manufacturer Part Number:

    LTR18EZPJ152

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.75 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IATF 16949

  • Resistance:

    1500 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0612

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

LTR18EZPJ152 Frequently Asked Questions (FAQs)

  • The recommended land pattern for LTR18EZPJ152 is a rectangular pad with a size of 1.7mm x 1.2mm, with a solder mask opening of 1.9mm x 1.4mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations for LTR18EZPJ152, ensure good thermal conductivity between the component and the PCB by using a thermal via or a thermal pad. Also, consider using a heat sink or a thermal interface material to improve heat dissipation.
  • The recommended reflow soldering profile for LTR18EZPJ152 is a peak temperature of 260°C, with a ramp-up rate of 3°C/s, a dwell time of 30-60 seconds, and a cool-down rate of 6°C/s.
  • Yes, LTR18EZPJ152 is designed to withstand high-vibration environments. However, it's essential to ensure proper mounting and soldering to prevent mechanical stress and vibration-induced failures.
  • To troubleshoot issues with LTR18EZPJ152, start by checking the component's voltage and current ratings, then verify the PCB layout and soldering quality. Use a multimeter to measure voltage and current, and an oscilloscope to check for signal integrity issues.

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LTR18EZPJ152 Overview

Use the download button to access the LTR18EZPJ152 schematic symbol, PCB footprint, and 3D model.
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