LTW-M670ZVS footprint, schematic symbol and 3D model by Lite-On

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LTW-M670ZVS Details

A 2-layer or 4-layer PCB with a large copper area for heat dissipation is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat transfer.
Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and consider using a heat sink with a thermal resistance of less than 10°C/W.
The maximum allowable voltage stress is 1.5 times the maximum rated voltage. Exceeding this limit may cause permanent damage to the device.
Use an ESD wrist strap or mat, handle the device by the body or pins, and avoid touching the pins or die. Ensure the PCB has ESD protection circuits and follow proper handling and storage procedures.
Use a soldering profile with a peak temperature of 240°C to 250°C, a dwell time of 30-60 seconds, and a cooling rate of 4°C/s to 6°C/s.

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