17 X 17 MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, BGA-256
Pin Count:
256
HTS Code:
8542.31.00.25
Manufacturer:
Intel Corporation
YTEOL:
0
Address Bus Width:
26
Bit Size:
32
Boundary Scan:
YES
Clock Frequency-Max:
3.6864 MHz
External Data Bus Width:
32
Format:
FIXED POINT
Integrated Cache:
YES
JESD-30 Code:
S-PBGA-B256
JESD-609 Code:
e1
Length:
17 mm
Low Power Mode:
YES
Number of Terminals:
256
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA256,16X16,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
250
Qualification Status:
Not Qualified
Seated Height-Max:
2 mm
Speed:
400 MHz
Supply Voltage-Max:
1.64 V
Supply Voltage-Min:
1.235 V
Supply Voltage-Nom:
1.3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
40
Width:
17 mm
uPs/uCs/Peripheral ICs Type:
MICROPROCESSOR
LUPXA255A0E400 Frequently Asked Questions (FAQs)
Intel provides a reference design guide for PCB layout and thermal management in the 'Intel Programmable Solutions: PCB Design Guidelines' document. Additionally, thermal design should follow the guidelines outlined in the 'Intel Thermal Design Guide'.
Intel recommends using a power management IC (PMIC) specifically designed for FPGAs, such as the Intel Enpirion Power Solutions. The PMIC should be configured according to the FPGA's power requirements, and power sequencing should follow the guidelines outlined in the 'Intel FPGA Power Management' document.
Intel provides guidelines for signal integrity and routing in the 'Intel FPGA Signal Integrity' document. Best practices include using controlled impedance routing, minimizing signal length and skew, and using signal integrity analysis tools to optimize the design.
Intel provides a range of tools and resources to optimize FPGA performance and power consumption, including the Intel Quartus Prime Software, the Intel FPGA Power and Thermal Calculator, and the Intel FPGA Optimization Guide.
The LUPXA255A0E400 features built-in reliability and availability features such as error correction, redundancy, and fault tolerance. Intel provides guidelines for implementing these features in the 'Intel FPGA Reliability and Availability' document.
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LUPXA255A0E400 Overview
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