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LV52204MUTBG - onsemi

Description: ON SEMICONDUCTOR - LV52204MUTBG - Led Driver, 1 Output, Boost (Step Up), 2.7V-5.5V in, 600kHz switch, 37V/20mA out, UDFN-6

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PCB Footprints
LV52204MUTBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - UDFN6 2x2, 0.65P CASE 517AB ISSUE C
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3D Models
LV52204MUTBG - onsemi  - 3D model - Small Outline No-lead - UDFN6 2x2, 0.65P CASE 517AB ISSUE C
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LV52204MUTBG Details

  • Manufacturer Part Number:

    LV52204MUTBG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    UDFN-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    517AB

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    10

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.55 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

  • fmax-Min:

    0.1 MHz

LV52204MUTBG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, ensure proper PCB design, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) between the device and heat sink.
  • Use a shielded enclosure, ensure proper grounding, and implement EMI filters on input/output lines. Also, consider using a common-mode choke and a ferrite bead on the input power lines.
  • Use the shutdown pin to disable the device when not in use, and ensure that all input signals are at a valid logic level during shutdown. Also, consider using a low-power mode or dynamic voltage and frequency scaling.
  • Use a 4-wire Kelvin connection for accurate voltage measurements. Ensure proper probe placement and use a high-impedance probe to minimize loading effects. Also, consider using a thermal camera for thermal profiling.

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LV52204MUTBG Overview

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