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LX7178-01CSP - Microsemi Corporation

Description: WLCSP 20 Ball 0.4mm Pitch

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PCB Footprints
LX7178-01CSP - Microsemi Corporation PCB footprint - BGA - BGA - WLCSP 20 Ball 0.4mm Pitch
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3D Models
LX7178-01CSP - Microsemi Corporation  - 3D model - BGA - WLCSP 20 Ball 0.4mm Pitch
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LX7178-01CSP Details

  • Manufacturer Part Number:

    LX7178-01CSP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • JESD-30 Code:

    R-PBGA-B20

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA20,4X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    2250 kHz

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

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LX7178-01CSP Overview

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