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M1MA152WAT1G - onsemi

Description: Fast trr, < 10 ns; Available in 8 mm Tape and Reel Use M1MA151/2WAT1 to order the 7 inch/3000 unit reel. Use M1MA151/2WAT3 to order the 13 inch/10,000 unit reel.; Low CD, < 15 pF; Pb-Free Packages are Available

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PCB Footprints
M1MA152WAT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-59 CASE 318D-04
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3D Models
M1MA152WAT1G - onsemi  - 3D model - SOT23 (3-Pin) - SC-59 CASE 318D-04
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M1MA152WAT1G Details

  • Manufacturer Part Number:

    M1MA152WAT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-59 3 LEAD

  • Package Description:

    LEAD FREE, CASE 318D-04, SC-59, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    ULTRA FAST RECOVERY

  • Breakdown Voltage-Min:

    80 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.5 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    80 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Recovery Time-Max:

    0.01 µs

  • Reverse Test Voltage:

    75 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

M1MA152WAT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal management techniques such as heat sinks or thermal interfaces.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent overheating.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Follow proper PCB design and handling practices to minimize ESD risks.
  • Follow the recommended soldering profile and rework conditions specified in the datasheet or onsemi's application notes. Use a soldering iron with a temperature range of 250°C to 260°C, and avoid exposing the device to excessive heat or moisture.

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M1MA152WAT1G Overview

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Part Image M1MA152WAT1 onsemi

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