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M24C04-WBN6P - STMicroelectronics

Description: STMicroelectronics M24C04-WBN6P EEPROM Memory, 4kbit, 900ns, 2.5 → 5.5 V 8-Pin PDIP

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PCB Footprints

M24C04-WBN6P - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PDIP8_2020
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3D Models

M24C04-WBN6P - STMicroelectronics  - 3D model - Dual-In-Line Packages - PDIP8_2020
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M24C04-WBN6P Details

  • Manufacturer Part Number:

    M24C04-WBN6P

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    ROHS COMPLIANT, PLASTIC, DIP-8

  • Pin Count:

    8

  • Reach Compliance Code:

    compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    STMicroelectronics

  • Risk Rank:

    7.67

  • Samacsys Modified On:

    2020-10-29 06:27:00

  • Clock Frequency-Max (fCLK):

    0.4 MHz

  • Data Retention Time-Min:

    40

  • Endurance:

    1000000 Write/Erase Cycles

  • I2C Control Byte:

    1010DDMR

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.27 mm

  • Memory Density:

    4096 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    512 words

  • Number of Words Code:

    512

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512X8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Supplies:

    3/5 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.33 mm

  • Serial Bus Type:

    I2C

  • Standby Current-Max:

    0.000001 A

  • Subcategory:

    EEPROMs

  • Supply Current-Max:

    0.002 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.62 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE

Risk Rank: Design Risk

M24C04-WBN6P — STMicroelectronics
2.2 - Low Design Risk
Design Risk Rank is determined by in-depth analysis across multiple factors, including part availability, functional equivalents, lifecycle and more. Learn more →

Risk Rank

Risk Rank is a proprietary algorithm Supplyframe has developed to quantify component risk using multiple data points. This ranking helps engineers and buyers determine whether alternates should be sought for parts that are deemed as high risk.

Risk Rank Example

Risk Rank is determined by a combination of factors such as product lifecycle status, price & inventory volatility, current inventory availability and much more. Even the availability of manufacturer specifications, part documentation such as datasheets and reference designs have an impact on determining the overall riskiness of a part.

The risk is characterized across three product phases:

  • Design
  • Production
  • Long Term

We focus on the Design Phase on Component Search Engine in our evaluation of Risk.

Design Phase

The design phase of a product is at the beginning of the product lifecycle. This is when engineers are doing analysis of components in the marketplace, determining which specifications are most important for their design and assessing the cost impact of using this particular component. While this is early in the product lifecycle, choices at this point can severely impact a product much later on when the product is being made. Additionally, this stage is the one furthest from a product being made, which is why we focus on metrics of stability over time when determining Design Risk.

Risk Rank Breakdown

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M24C04-WBN6P Overview

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