M27C256B-70XF1 - STMicroelectronics

M27C256B-70XF1 Details

• Manufacturer Part Number:

  M27C256B-70XF1

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  DIP

• Package Description:

  0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28

• Pin Count:

  28

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.61

• Manufacturer:

  STMicroelectronics

• YTEOL:

  0

• Access Time-Max:

  70 ns

• I/O Type:

  COMMON

• JESD-30 Code:

  R-CDIP-T28

• JESD-609 Code:

  e3

• Length:

  36.92 mm

• Memory Density:

  262144 bit

• Memory IC Type:

  UVPROM

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  28

• Number of Words:

  32768 words

• Number of Words Code:

  32000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  32KX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  CERAMIC, METAL-SEALED COFIRED

• Package Code:

  WDIP

• Package Equivalence Code:

  DIP28,.6

• Package Shape:

  RECTANGULAR

• Package Style:

  IN-LINE, WINDOW

• Parallel/Serial:

  PARALLEL

• Programming Voltage:

  12.75 V

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  5.72 mm

• Standby Current-Max:

  0.0001 A

• Supply Current-Max:

  0.03 mA

• Supply Voltage-Max (Vsup):

  5.25 V

• Supply Voltage-Min (Vsup):

  4.75 V

• Supply Voltage-Nom (Vsup):

  5 V

• Surface Mount:

  NO

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  MATTE TIN

• Terminal Form:

  THROUGH-HOLE

• Terminal Pitch:

  2.54 mm

• Terminal Position:

  DUAL

• Width:

  15.24 mm