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M29W640GH70ZA6E - Micron

Description: NOR Flash Parallel 3.3V 64M-bit 8M x 8/4M x 16 70ns 48-Pin TFBGA Tray

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PCB Footprints
M29W640GH70ZA6E - Micron PCB footprint - BGA - BGA - TFBGA48 6x8mm-6x8 Ball Array, 0.8mm Pitch
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M29W640GH70ZA6E - Micron  - 3D model - BGA - TFBGA48 6x8mm-6x8 Ball Array, 0.8mm Pitch
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M29W640GH70ZA6E Details

  • Manufacturer Part Number:

    M29W640GH70ZA6E

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    TFBGA-48

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Access Time-Max:

    70 ns

  • Alternate Memory Width:

    8

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B48

  • Length:

    8 mm

  • Memory Density:

    67108864 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Sectors/Size:

    128

  • Number of Terminals:

    48

  • Number of Words:

    4194304 words

  • Number of Words Code:

    4000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA48,6X8,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Page Size:

    4/8 words

  • Parallel/Serial:

    PARALLEL

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    64K

  • Standby Current-Max:

    0.0001 A

  • Supply Current-Max:

    0.01 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    6 mm

M29W640GH70ZA6E Frequently Asked Questions (FAQs)

  • The M29W640GH70ZA6E has an operating temperature range of -40°C to 85°C.
  • The device requires a controlled power-up and power-down sequence to prevent damage. A slow ramp-up of VCC to the recommended voltage (3.3V) is recommended, and power-down should be done in the reverse order.
  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Decoupling capacitors should be placed close to the device, and signal traces should be kept short and away from noise sources.
  • The device's input/output timing and signal integrity can be ensured by following the recommended timing diagrams and signal integrity guidelines in the datasheet, and by using a signal integrity analysis tool to simulate and optimize the design.
  • The M29W640GH70ZA6E has a FIT (Failure In Time) rate of < 10, and a MTBF (Mean Time Between Failures) of > 100,000 hours. It also meets the JEDEC standards for reliability and quality.

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M29W640GH70ZA6E Overview

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Part Image M29W640GH70ZA6E STMicroelectronics

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Part Image M29W640GH7AZA6E Micron Technology Inc

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Part Image M29W640GH7AZA6F Micron Technology Inc

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Part Image M29W640GH70ZA6F Micron Technology Inc

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