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M48T37V-10MH6E - STMicroelectronics

Description: 5.0 or 3.3 V, 256 Kbit (32 Kbit x 8) TIMEKEEPER® SRAM

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M48T37V-10MH6E - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SOH44
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M48T37V-10MH6E - STMicroelectronics  - 3D model - Small Outline Packages - SOH44
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M48T37V-10MH6E Details

  • Manufacturer Part Number:

    M48T37V-10MH6E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    44

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Memory IC Type:

    STANDARD SRAM

M48T37V-10MH6E Frequently Asked Questions (FAQs)

  • The M48T37V-10MH6E can operate from -40°C to +85°C, but it's recommended to use it within the -20°C to +70°C range for optimal performance.
  • The POR and VS functions are internally connected and cannot be separated. The VS function monitors the VCC supply voltage and resets the device when it falls below the minimum operating voltage (VCC(min)).
  • The M48T37V-10MH6E requires a 32.768 kHz crystal oscillator with a maximum ESR of 30 kΩ and a load capacitance of 12.5 pF to 20 pF.
  • Use the VCC monitor and power-down flag to detect power-down events and save critical data to the non-volatile memory before power-down. During power-up, use the power-up flag to detect the power-up event and restore the saved data.
  • The RTC and calendar functions can operate up to 32.768 kHz, but the maximum clock frequency for the clock and calendar functions is 1 kHz.

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M48T37V-10MH6E Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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