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M74HC4049B1N - STMicroelectronics

Description: Hex Buffer/Converter

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M74HC4049B1N - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - Plastic DIP-16 (0.25)
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3D Models
M74HC4049B1N - STMicroelectronics  - 3D model - Dual-In-Line Packages - Plastic DIP-16 (0.25)
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M74HC4049B1N Details

  • Manufacturer Part Number:

    M74HC4049B1N

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, DIL-16

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Family:

    HC/UH

  • JESD-30 Code:

    R-PDIP-T16

  • JESD-609 Code:

    e0

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    INVERTER

  • Max I(ol):

    0.006 A

  • Number of Functions:

    6

  • Number of Inputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Prop. Delay@Nom-Sup:

    21 ns

  • Propagation Delay (tpd):

    125 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

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M74HC4049B1N Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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