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M95256-WMN3TP/A - STMicroelectronics

Description: 2.5V ~ 5.5V, 256-Kbit serial SPI bus EEPROM Memory IC 256Kbit SPI 20 MHz 8-SOIC

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M95256-WMN3TP/A Details

  • Manufacturer Part Number:

    M95256-WMN3TP/A

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    3

  • Clock Frequency-Max (fCLK):

    5 MHz

  • Data Retention Time-Min:

    40

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000005 A

  • Supply Current-Max:

    0.006 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE/SOFTWARE

M95256-WMN3TP/A Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN1156, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The M95256-WMN3TP/A has an internal POR and BOR circuitry. To handle these reset events, engineers can use external resistors and capacitors to filter the power supply and ensure a clean reset signal. Additionally, the device's reset output pin can be connected to a microcontroller's reset input to ensure proper system initialization.
  • The M95256-WMN3TP/A's I2C interface can operate up to 400 kHz, but the actual frequency may be limited by the system's clock speed, bus capacitance, and other factors. Engineers should consult the I2C bus specification and perform thorough testing to ensure reliable operation at the desired frequency.
  • To ensure data retention during power-down events, engineers can use an external battery or supercapacitor to maintain power to the EEPROM. Additionally, the M95256-WMN3TP/A has a built-in VCC pin that can be connected to a backup power source to maintain data integrity.
  • The M95256-WMN3TP/A has a maximum junction temperature of 150°C. Engineers should ensure proper thermal management by providing adequate heat dissipation through PCB design, component placement, and thermal interface materials. They should also consider the device's power consumption and thermal resistance to prevent overheating.

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M95256-WMN3TP/A Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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