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M95512-DFCS6TP/K - STMicroelectronics

Description: EEPROM Serial-SPI 512K-bit 64K x 8 1.8V/2.5V/3.3V/5V 8-Pin WLCSP T/R

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M95512-DFCS6TP/K - STMicroelectronics - PCB symbol
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M95512-DFCS6TP/K - STMicroelectronics PCB footprint - Other - Other - WLCSP8
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M95512-DFCS6TP/K - STMicroelectronics - 3D model - Other - WLCSP8
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M95512-DFCS6TP/K Details

  • Manufacturer Part Number:

    M95512-DFCS6TP/K

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Clock Frequency-Max (fCLK):

    5 MHz

  • JESD-30 Code:

    R-PBGA-B8

  • Length:

    1.937 mm

  • Memory Density:

    524288 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    65536 words

  • Number of Words Code:

    64000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    64KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.58 mm

  • Serial Bus Type:

    SPI

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Width:

    1.271 mm

M95512-DFCS6TP/K Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable data retention, it is essential to follow the recommended power-up and power-down sequences, and to avoid power cycling during write operations. Additionally, the device should be operated within the recommended voltage and temperature ranges.
  • Not following the recommended erase and programming procedures can lead to incomplete erasure, data corruption, or even device damage. It is crucial to follow the recommended protocols to ensure reliable device operation.
  • The POR and BOR features are designed to ensure the device resets correctly during power-up and power-down events. It is essential to follow the recommended power-up and power-down sequences to ensure proper device operation.
  • Operating the device beyond the recommended temperature range can lead to reduced performance, data corruption, or even device failure. It is crucial to operate the device within the recommended temperature range to ensure reliable operation.

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M95512-DFCS6TP/K Overview

Use the download button to access the M95512-DFCS6TP/K schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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