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M95640-DRDW8TP/K - STMicroelectronics

Description: 64-Kbit serial SPI bus EEPROM with high speed clock 105°C operation

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M95640-DRDW8TP/K - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - . TSSOP8 – Mechanical data-
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M95640-DRDW8TP/K Details

  • Manufacturer Part Number:

    M95640-DRDW8TP/K

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Clock Frequency-Max (fCLK):

    10 MHz

  • Data Retention Time-Min:

    50

  • Endurance:

    900000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000001 A

  • Supply Current-Max:

    0.005 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

  • Write Cycle Time-Max (tWC):

    4 ms

  • Write Protection:

    HARDWARE/SOFTWARE

M95640-DRDW8TP/K Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 4 thermal vias under the package is recommended.
  • To ensure reliable data retention, it's essential to follow the recommended storage conditions (–65°C to +150°C) and handling procedures. Additionally, consider using a temperature sensor to monitor the device's operating temperature and implement data backup or redundancy mechanisms.
  • To prevent damage, ensure a slow and controlled power-up sequence (typically 1-10 ms) and power-down sequence. Avoid sudden voltage changes, and ensure the device is fully powered down before removing power. Follow the recommended power-up and power-down sequences outlined in the datasheet.
  • Use a logic analyzer or oscilloscope to monitor the device's signals and identify potential issues. Check the device's status registers and error flags to diagnose problems. Consult the datasheet and application notes for troubleshooting guidelines and FAQs.
  • Handle the device by the body or in an ESD-protected environment. Use anti-static wrist straps, mats, or bags to prevent electrostatic discharge. Store the device in its original packaging or an ESD-protected container to prevent damage.

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M95640-DRDW8TP/K Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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