A 4-layer PCB with a dedicated ground plane, and a thermal via array under the device to dissipate heat, is recommended. A low-loss, high-frequency laminate such as Rogers 4350 or equivalent is also suggested.
Use a low-ESR capacitor (e.g., 100nF) between the drain and ground pins, and a high-frequency choke or ferrite bead in series with the drain supply to prevent oscillations.
The maximum junction temperature (Tj) is 150°C. Ensure proper heat sinking and thermal management to maintain a safe operating temperature.
Yes, but it's essential to ensure proper phasing and impedance matching between the two amplifiers to maintain stability and prevent oscillations.
A λ/4 transformer or a low-pass matching network with a series inductor and shunt capacitor can be used for input matching. For output matching, a λ/4 transformer or a high-pass matching network with a series capacitor and shunt inductor is recommended.
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