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MABA-010125-TC1113 - MACOM

Description: Audio Transformers / Signal Transformers 4.5-3000MHz IL 2.8dB Impedance Ratio 1:1

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PCB Footprints
MABA-010125-TC1113 - MACOM PCB footprint - Other - Other - MABA-010125-TC1113-1
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3D Models
MABA-010125-TC1113 - MACOM  - 3D model - Other - MABA-010125-TC1113-1
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MABA-010125-TC1113 Details

  • Manufacturer Part Number:

    MABA-010125-TC1113

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • Manufacturer:

    MACOM

  • YTEOL:

    7

  • Additional Feature:

    BREADTH DIM. INCLUDES TERMINALS ALSO; IMPEDANCE RATIO IS 1:1

  • Application:

    SIGNAL

  • Cut-off Frequency-Max:

    3000 MHz

  • Cut-off Frequency-Min:

    4.5 MHz

  • Height:

    2.8 mm

  • Insertion Loss:

    2.8 dB

  • Length:

    3.81 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Primary Winding:

    1

  • Number of Secondary Winding:

    1

  • Operating Frequency-Max:

    3000000 kHz

  • Operating Frequency-Min:

    4500 kHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current 1:

    0.05 A

  • Packing Method:

    TAPE & REEL

  • Power Rating:

    0.25 W

  • Surface Mount:

    YES

  • Transformer Type:

    RF TRANSFORMER

  • Turns Ratio (Np:Ns):

    1:1

  • Width:

    3.81 mm

MABA-010125-TC1113 Frequently Asked Questions (FAQs)

  • MACOM recommends a specific PCB layout and land pattern to ensure optimal performance. Engineers can request the recommended layout and land pattern from MACOM's application support team or through their authorized distributors.
  • To ensure proper biasing, engineers should follow the recommended biasing circuit and voltage levels outlined in the datasheet. Additionally, they should ensure that the device is operated within the recommended operating conditions and that the input and output impedances are properly matched.
  • The MABA-010125-TC1113 is a high-power device and requires proper thermal management to ensure reliable operation. Engineers should ensure that the device is mounted on a heat sink or thermal pad, and that the PCB is designed to dissipate heat effectively.
  • To troubleshoot common issues, engineers can follow a systematic approach, checking for proper biasing, impedance matching, and thermal management. They can also consult MACOM's application notes and technical support resources for guidance on troubleshooting specific issues.
  • The MABA-010125-TC1113 has undergone rigorous reliability and qualification tests, including temperature cycling, humidity testing, and electrical stress testing. Engineers can request detailed information on the device's reliability and qualification tests from MACOM's quality and reliability team.

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