MACOM recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a thermal plane on the PCB.
The device requires a bias tee or a DC block to provide the correct voltage and current. A bias voltage of 5V and a current of 100mA is recommended. The bias circuit should be designed to provide a low impedance path to ground.
MACOM recommends a conjugate match at the input and output of the device. A pi-network or a T-network can be used to match the device to 50 ohms. The matching network should be designed to provide a return loss of at least 15dB.
The device is sensitive to ESD, so it's essential to handle it in an ESD-controlled environment. Use ESD-safe materials, and ensure that all personnel handling the device are grounded. Avoid touching the device's pins or exposed die.
Store the device in its original packaging or in a dry, ESD-controlled environment. Avoid exposing the device to moisture, direct sunlight, or extreme temperatures. Handle the device by the package, not the pins or die.
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MADL-011021-14150T Overview
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