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MADRCC0007 - MACOM

Description: High Speed CMOS Technology  Quad Channel  Positive Voltage Control  Low Power Dissipation  Low Cost Plastic SOIC-16 Package  100% Matte Tin Plating over Copper  Halogen-Free ―Green‖ Mold Compound  260°C Reflow Compatible  RoHS* Compliant Version of SWD-119

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Symbol
MADRCC0007 - MACOM - PCB symbol
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PCB Footprints
MADRCC0007 - MACOM PCB footprint - Small Outline Packages - Small Outline Packages - Lead-Free, SOIC-16
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3D Models
MADRCC0007 - MACOM - 3D model - Small Outline Packages - Lead-Free, SOIC-16
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MADRCC0007 Details

  • Manufacturer Part Number:

    MADRCC0007

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, MS-012AC, SOIC-16

  • Pin Count:

    16

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    MACOM

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

MADRCC0007 Frequently Asked Questions (FAQs)

  • MACOM recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the package should be connected to a heat sink or a thermal management system.
  • Optimize the biasing circuit by using a resistive divider network to set the gate voltage, and a current source or a resistive load to set the drain voltage. Ensure the biasing circuit is decoupled from the RF signal path.
  • Use a conjugate match at the input and output ports to maximize power transfer. A series inductor and shunt capacitor can be used for input matching, while a series capacitor and shunt inductor can be used for output matching.
  • Use a combination of resistive and reactive components to stabilize the amplifier. Add a resistor in series with the gate to prevent oscillations, and use a ferrite bead or a resistive divider to dampen oscillations.
  • The maximum safe operating temperature for the MADR-0007 is 150°C. Operating the device above this temperature can reduce its reliability and lifespan.

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MADRCC0007 Overview

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MADRCC0007 Alternates

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For a full list of alternate parts for MADRCC0007, check out Findchips.com