MACOM recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the package should be connected to a thermal management system, such as a heat sink or thermal interface material.
MACOM provides a recommended PCB layout and impedance matching network in the application note AN-60-015. Additionally, the device's input and output impedance can be matched using a combination of series and shunt resistors, capacitors, and inductors.
The MAPD-011027 is rated for operation from -40°C to +85°C. However, the device's performance may degrade at higher temperatures, and it's recommended to derate the power dissipation accordingly.
Yes, the MAPD-011027 can be used in a push-pull configuration to achieve higher output power and improved linearity. However, this requires careful impedance matching and biasing to ensure proper operation.
The recommended biasing scheme is provided in the datasheet and application notes. Typically, a voltage-controlled current source is used to set the quiescent current, and the device is biased in Class AB operation.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MAPD-011027 Overview
Use the download button to access the MAPD-011027 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAPD-,
or try a keyword search, such as RF/Microwave Splitter/Combiners
