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MAX1619MEE+ - Analog Devices

Description: Board Mount Temperature Sensors Remote/Local Temp Sensor w Dual Alarm

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MAX1619MEE+ - Analog Devices - PCB symbol
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MAX1619MEE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MAX 21-0055_O
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MAX1619MEE+ - Analog Devices - 3D model - Small Outline Packages - MAX 21-0055_O
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MAX1619MEE+ Details

  • Manufacturer Part Number:

    MAX1619MEE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    0.150 INCH, 0.025 INCH PITCH, QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • Date Of Intro:

    1999-04-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Accuracy-Max (Cel):

    3 Cel

  • Body Breadth:

    3.9 mm

  • Body Height:

    1.47 mm

  • Body Length or Diameter:

    4.89 mm

  • Housing:

    PLASTIC

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    8

  • Number of Terminals:

    16

  • Operating Current-Max:

    0.12 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Interface Type:

    2-WIRE INTERFACE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape/Style:

    RECTANGULAR

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Termination Type:

    SOLDER

MAX1619MEE+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX1619MEE+ involves keeping the input and output traces short and separate, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure the accuracy of the voltage monitoring function, it's essential to use high-precision resistors for the voltage divider network, and to minimize the noise and interference on the input lines. Additionally, the input voltage range should be within the specified range of the device, and the output voltage should be buffered with an op-amp if necessary.
  • The MAX1619MEE+ has an operating temperature range of -40°C to +125°C, making it suitable for use in a wide range of applications, including automotive and industrial systems.
  • Yes, the MAX1619MEE+ is a high-reliability device that meets the requirements of various industries, including aerospace and medical devices. It's manufactured using a robust process, and it's tested to ensure high reliability and low defect rates.
  • To troubleshoot issues with the MAX1619MEE+, start by checking the input voltage and the voltage divider network for any errors or malfunctions. Verify that the device is properly powered and that the input voltage is within the specified range. Use an oscilloscope to check the output voltage and the internal voltage reference. If the issue persists, consult the datasheet and application notes for further guidance.

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MAX1619MEE+ Overview

Use the download button to access the MAX1619MEE+ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX16, or try a keyword search, such as Temperature Sensors

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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