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MAX17135ETJ+ - Analog Devices

Description: Switching Voltage Regulators Multi-Output DC-DC Power Supply with VCOM Amplifier and TemperatureSensor for E-Paper Applications

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MAX17135ETJ+ - Analog Devices - PCB symbol
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PCB Footprints
MAX17135ETJ+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T3255+1_2022
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3D Models
MAX17135ETJ+ - Analog Devices - 3D model - Quad Flat No-Lead - T3255+1_2022
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MAX17135ETJ+ Details

  • Manufacturer Part Number:

    MAX17135ETJ+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    32-LFCSP-5X5X0.75

  • Package Description:

    TQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    32-LFCSP-5X5X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2011-11-08

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XQCC-N32

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HWQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

MAX17135ETJ+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX17135ETJ+ involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated power plane is also recommended.
  • To optimize the performance of the MAX17135ETJ+, ensure that the input voltage is within the recommended range, use high-quality capacitors with low ESR, and minimize the output voltage ripple. Additionally, optimize the PCB layout to reduce noise and electromagnetic interference (EMI).
  • The MAX17135ETJ+ has an operating temperature range of -40°C to +125°C, making it suitable for use in a wide range of applications, including automotive and industrial systems.
  • Yes, the MAX17135ETJ+ is designed for high-reliability applications and is qualified to AEC-Q100 Grade 1, which means it can operate in harsh environments with high temperatures and humidity.
  • To troubleshoot issues with the MAX17135ETJ+, start by checking the input voltage, output voltage, and current. Verify that the device is properly configured and that the capacitors are of high quality and properly sized. Use an oscilloscope to check for noise and ripple on the output voltage. Consult the datasheet and application notes for additional troubleshooting guidance.

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MAX17135ETJ+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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