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MAX17575ATC+ - Analog Devices

Description: Maxim, MAX17575ATC+ Step-Down Switching Regulator 1.5A Adjustable 12-Pin, TDFN

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MAX17575ATC+ - Analog Devices - PCB symbol
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PCB Footprints
MAX17575ATC+ - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - MAX17575ATC+
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MAX17575ATC+ - Analog Devices - 3D model - Small Outline No-lead - MAX17575ATC+
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MAX17575ATC+ Details

  • Manufacturer Part Number:

    MAX17575ATC+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    12-LFCSP-3X3X0.75

  • Pin Count:

    12

  • Manufacturer Package Code:

    12-LFCSP-3X3X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-09-07

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    ALSO HAS PFM CONTROL LOGIC

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    S-PDSO-N12

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2.8 A

  • Output Voltage-Max:

    54 V

  • Output Voltage-Min:

    0.9 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC12,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2450 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX17575ATC+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX17575ATC+ involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it is recommended to place the device away from high-current carrying traces and heat sources.
  • To optimize the performance of the MAX17575ATC+, it is recommended to carefully select the input and output capacitors, ensure proper PCB layout and thermal management, and adjust the device's configuration registers according to the specific application requirements. Additionally, it is recommended to consult the device's evaluation kit and reference design for guidance.
  • Potential failure modes of the MAX17575ATC+ include overvoltage, undervoltage, and overheating. To mitigate these failure modes, it is recommended to implement overvoltage protection, undervoltage lockout, and thermal monitoring and protection. Additionally, it is recommended to follow proper PCB design and manufacturing practices to minimize the risk of electrical overstress and thermal damage.
  • To troubleshoot issues with the MAX17575ATC+, it is recommended to consult the device's datasheet and application notes, and to use debugging tools such as oscilloscopes and logic analyzers. Additionally, it is recommended to check the device's configuration registers, input and output voltages, and thermal performance to identify the root cause of the issue.
  • Thermal management considerations for the MAX17575ATC+ include ensuring proper airflow, using a heat sink if necessary, and minimizing the thermal resistance between the device and the PCB. Additionally, it is recommended to follow proper PCB design practices to minimize thermal hotspots and ensure efficient heat dissipation.

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MAX17575ATC+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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