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MAX20075ATCB/V+ - Analog Devices

Description: 36V, 600mA/1.2A Mini Buck Converter

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MAX20075ATCB/V+ - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 12-LFCSP-3X3X0.75-1
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MAX20075ATCB/V+ - Analog Devices  - 3D model - Small Outline No-lead - 12-LFCSP-3X3X0.75-1
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MAX20075ATCB/V+ Details

  • Manufacturer Part Number:

    MAX20075ATCB/V+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    12-LFCSP-3X3X0.75

  • Package Description:

    TDFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    12-LFCSP-3X3X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-01-15

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    3.5 V

  • Input Voltage-Nom:

    14 V

  • JESD-30 Code:

    S-PDSO-N12

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.6 A

  • Output Voltage-Max:

    10 V

  • Output Voltage-Min:

    3 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HWSON

  • Package Equivalence Code:

    SOLCC12,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2275 kHz

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

MAX20075ATCB/V+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX20075ATCB/V+ involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. Additionally, the device should be placed near the power source to minimize power trace length.
  • To ensure proper power-up and configuration, the MAX20075ATCB/V+ requires a power-on reset (POR) circuit to reset the device during power-up. The POR circuit should be designed to provide a minimum reset pulse width of 10ms. Additionally, the device's configuration pins (such as EN, MODE, and FLT) should be properly biased during power-up to ensure the device is configured correctly.
  • A recommended input filter configuration for the MAX20075ATCB/V+ involves using a pi-filter (C-R-C) or a T-filter (L-C-R) topology with a cutoff frequency of around 100kHz to 1MHz. The filter components should be chosen to provide a balance between noise attenuation and signal integrity. Additionally, the input filter should be placed as close to the device as possible to minimize noise pickup.
  • To troubleshoot issues with the MAX20075ATCB/V+, start by verifying the power supply and input voltage levels. Check the device's configuration pins to ensure they are properly biased. Use an oscilloscope to monitor the device's output and input signals to identify any anomalies. Additionally, use a logic analyzer to verify the device's digital signals and ensure they are correct. If issues persist, consult the device's datasheet and application notes for guidance.
  • To prevent overheating, the MAX20075ATCB/V+ requires proper thermal management. The device's thermal pad should be connected to a solid ground plane or a thermal via to dissipate heat. The PCB should be designed to provide good thermal conductivity, and the device should be placed in a location with good airflow. Additionally, the device's power dissipation should be calculated and managed to prevent excessive heat generation.

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MAX20075ATCB/V+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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