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MAX20327EWL+ - Analog Devices

Description: Analog Switch ICs Ultra Small Low Ron DPDT Analog Switch

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MAX20327EWL+ - Analog Devices - PCB symbol
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PCB Footprints
MAX20327EWL+ - Analog Devices PCB footprint - BGA - BGA - W91P1+1
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3D Models
MAX20327EWL+ - Analog Devices - 3D model - BGA - W91P1+1
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MAX20327EWL+ Details

  • Manufacturer Part Number:

    MAX20327EWL+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    9-WLCSP-N/A

  • Package Description:

    WLP-9

  • Pin Count:

    9

  • Manufacturer Package Code:

    9-WLCSP-N/A

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-09-13

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    DPDT

  • JESD-30 Code:

    S-XBGA-B9

  • Length:

    1.607 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Off-state Isolation-Nom:

    60 dB

  • On-state Resistance Match-Nom:

    0.002 Ω

  • On-state Resistance-Max (Ron):

    0.5 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Signal Current-Max:

    1.1 A

  • Supply Current-Max (Isup):

    0.09 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    30000 ns

  • Switch-on Time-Max:

    300000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.607 mm

MAX20327EWL+ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the MAX20327EWL+ can be found in the device's evaluation kit documentation or by contacting Analog Devices' technical support. A good layout should ensure proper thermal management, minimize noise coupling, and follow the recommended pinout and component placement.
  • To optimize the performance of the MAX20327EWL+, consider the specific requirements of your application, such as input voltage, output current, and operating frequency. Consult the datasheet and application notes for guidance on component selection, layout, and configuration. You may also want to consult with Analog Devices' technical support or use simulation tools to model and optimize your design.
  • The MAX20327EWL+ has a high-power density, so thermal management is crucial. Ensure good airflow around the device, use a heat sink if necessary, and follow the recommended PCB layout guidelines. The device's thermal resistance (θJA) is specified in the datasheet, and you can use thermal simulation tools to estimate the junction temperature (TJ) in your specific application.
  • To troubleshoot issues with the MAX20327EWL+, start by consulting the datasheet and application notes to ensure that the device is properly configured and that the recommended operating conditions are met. Use oscilloscopes and other diagnostic tools to identify the source of the issue. If necessary, contact Analog Devices' technical support for further assistance.
  • Yes, the MAX20327EWL+ is a high-frequency device, and EMI/EMC considerations are important. Follow proper PCB layout and shielding guidelines, use EMI filters and shielding components as necessary, and ensure that the device is properly decoupled from the power supply. Consult the datasheet and application notes for specific guidance on EMI/EMC design considerations.

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MAX20327EWL+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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