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MAX22565CAAP+ - Analog Devices

Description: Reinforced, Fast, Low-Power, Six-Channel Digital Isolators

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MAX22565CAAP+ - Analog Devices - PCB symbol
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PCB Footprints
MAX22565CAAP+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 20 SSOP
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3D Models
MAX22565CAAP+ - Analog Devices - 3D model - Small Outline Packages - 20 SSOP
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MAX22565CAAP+ Details

  • Manufacturer Part Number:

    MAX22565CAAP+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    20-SSOP-5.30_MM

  • Package Description:

    SSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    20-SSOP-5.30_MM

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2021-10-18

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    7.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.99 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.29 mm

MAX22565CAAP+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX22565CAAP+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals, and to minimize the length of the traces between the device and the power supply.
  • To ensure proper power-up and configuration, it's recommended to follow a specific power-up sequence, which involves applying the power supply voltage to the device before applying the input signals. Additionally, the device should be configured in a specific order, such as setting the output voltage and then enabling the output.
  • The MAX22565CAAP+ has a maximum junction temperature of 150°C, and it's recommended to keep the device temperature below 125°C for optimal performance. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid high ambient temperatures.
  • To troubleshoot issues with the MAX22565CAAP+, start by checking the power supply voltage and input signals to ensure they are within the recommended specifications. Then, use a oscilloscope or logic analyzer to monitor the device's output signals and identify any anomalies. Finally, consult the datasheet and application notes for troubleshooting guides and FAQs.
  • The MAX22565CAAP+ is a high-reliability device that meets various industry standards and certifications, including AEC-Q100 for automotive applications and IEC 60601-1 for medical devices. However, it's essential to consult the datasheet and Analog Devices' website for the latest compliance information and to ensure the device meets the specific requirements of your application.

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MAX22565CAAP+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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