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MAX253EPA+ - Analog Devices

Description: MAX253EPA+, MOSFET Power Driver, 1A, 2.5 to 6V, 8-Pin PDIP

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MAX253EPA+ - Analog Devices - PCB symbol
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PCB Footprints
MAX253EPA+ - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P8+1
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MAX253EPA+ - Analog Devices - 3D model - Dual-In-Line Packages - P8+1
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MAX253EPA+ Details

  • Manufacturer Part Number:

    MAX253EPA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-PDIP-300_MIL

  • Package Description:

    ROHS COMPLIANT, PLASTIC, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-PDIP-300_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    1994-01-01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.375 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.572 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.62 mm

MAX253EPA+ Frequently Asked Questions (FAQs)

  • The MAX253EPA+ is a high-frequency device, and proper layout and placement are crucial to minimize EMI and noise. It is recommended to follow the layout guidelines provided in the datasheet, including keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. Additionally, it is recommended to use a shielded enclosure and to keep the device away from other noise-generating components.
  • To ensure the MAX253EPA+ is properly biased and configured, it is recommended to follow the application circuit provided in the datasheet and to consult the device's evaluation board documentation. Additionally, it is recommended to consult with an experienced analog design engineer or to contact Analog Devices' technical support team for guidance on specific application requirements.
  • The MAX253EPA+ has a maximum junction temperature of 150°C, and it is recommended to ensure that the device operates within its recommended temperature range to prevent thermal shutdown and ensure reliable operation. This can be achieved by providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device. Additionally, it is recommended to monitor the device's temperature using a thermocouple or thermal sensor and to implement thermal protection measures such as thermal shutdown or reduced power operation if the device exceeds its recommended temperature range.
  • To troubleshoot common issues with the MAX253EPA+, it is recommended to follow a systematic approach, starting with a review of the device's datasheet and application notes. Common issues such as oscillation or instability can often be attributed to improper layout, inadequate decoupling, or incorrect biasing. It is recommended to use a oscilloscope to visualize the device's output and input signals, and to consult with an experienced analog design engineer or Analog Devices' technical support team for guidance on troubleshooting and resolving specific issues.
  • The MAX253EPA+ is a high-reliability device that meets or exceeds relevant industry standards for quality and reliability, including AEC-Q100 and ISO/TS 16949. The device is manufactured using a robust and reliable process, and it is subjected to rigorous testing and inspection to ensure that it meets or exceeds its specified performance and reliability metrics. Additionally, Analog Devices provides a range of quality and reliability documentation, including reliability reports and failure-in-time (FIT) rates, to support customers' reliability and quality requirements.

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MAX253EPA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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